Improved Performance and Thermal Efficiency with New Exynos 2400 SoC Packaging Technology

What you should know

  • Samsung‘s Exynos 2400 chipset will power the Galaxy S24 and Galaxy S24+ in most markets
  • Benchmark tests show that the Exynos 2400 chipset is not quite as powerful as the Snapdragon 8 Gen 3, but it is closer than in past years
  • Samsung Foundry is using FOWLP (Fan-Out Wafer Level Packaging) technology to improve thermals and reduce the size of chips
  • Using the Exynos 2400 chipset could save Samsung money and improve the reputation of Exynos chips for performance without overheating

Full Story

Samsung’s Exynos 2400 chipset is expected to power upcoming Galaxy S24 and Galaxy S24+ handsets in most markets. In the U.S. and China, those models will feature the Snapdragon 8 Gen 3 for Galaxy SoC, while the top-of-the-line Galaxy S24 Ultra will be equipped with Qualcomm’s latest flagship Snapdragon application processor (AP) in all regions. Benchmark tests suggest that while the Exynos 2400 is not quite the performer that the Snapdragon 8 Gen 3 is, it is still an improvement over previous versions, using a deca-core configuration. The deca-core configuration, which includes a Prime core Cortex-X4, two Cortex-A720 performance CPU cores, three more Cortex-A720 performance CPU cores, and four Cortex-A520 efficiency cores, requires strong thermals to avoid overheating. A report from Korea’s EDaily (via SamMobile) says that Samsung Foundry has started using FOWLP (Fan-Out Wafer Level Packaging) technology with chips that are currently being delivered to customers to help improve thermal performance.

FOWLP not only allows chips to run cooler, it allows them to be thinner. Chips using FOWLP are 40% smaller, 30% thinner, and deliver 15% greater performance. The Exynos 2400 AP, which is being built by Samsung Foundry using its second-generation 4nm process node (4LPP), is expected to use FOWLP chip packaging technology to improve power efficiency and reduce the chipset’s size. Samsung has high hopes for the Exynos 2400 AP. Not only will using the chipset save the company some money compared to what it spent this year to outfit the entire Galaxy S23 line with the Snapdragon 8 Gen 2 for Galaxy chipset, but it could also help Exynos chips gain a new reputation for performance without overheating.

Derrick Flynn
Derrick Flynn
With over four years of experience in tech journalism, Derrick has honed his skills and knowledge to become a vital part of the PhonesInsights team. His intuitive reviews and insightful commentary on the latest smartphones and wearable technology consistently provide our readers with valuable information.


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